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High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger

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High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger

MOQ : 1

Price : Send us Gerber file for free quotation

Payment Terms : T/T

Layer : 1-108 Layer

Base Material : Fr4

Thickness : 0.5-10mm

Copper Thickness : 0.5-15OZ

Board Size : Customized

Min. Line Width/Space : 0.10/0.10mm

Surface Treatment : ENIG/Immersion gold

Certificate : UL,IATF16949,ISO&Reach

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High Precision PCB Fabrication Assembly for Wireless Charger

♦ What's PCB Fabrication?

PCB Fabrication (or PCB Manufacturing) is the process of transforming a circuit board design (typically provided as Gerber files) into a physical printed circuit board (PCB). It involves multiple steps, from etching copper layers to drilling holes and applying protective coatings, resulting in a bare PCB ready for component assembly.

High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger

♦ Key Steps in PCB Fabrication:

1. Design & File Preparation

- The process starts with PCB design files (Gerber, drill files, BOM).
- Engineers verify the design for manufacturability (DFM check).

2. Printing the Design on Copper Clad Laminate

- A photosensitive film is applied to a copper-clad board (usually FR4).
- The PCB layout is printed using UV light, transferring the circuit pattern.

3. Etching the Copper

- The board is chemically etched (acid bath) to remove unwanted copper, leaving only the desired traces.

4. Drilling Holes

- Precision CNC machines drill holes for vias (plated holes) and component leads.
- Laser drilling is used for microvias in HDI (High-Density Interconnect) PCBs.

5. Plating & Copper Deposition

- Electroplating adds a thin copper layer to the drilled holes, creating electrical connections between layers.
- Additional coatings (e.g., ENIG, HASL, OSP) may be applied for solderability.

6. Applying Solder Mask & Silkscreen

- Solder mask (usually green) is added to prevent short circuits.
- Silkscreen prints component labels (text, logos).

7. Surface Finish Application

- Common finishes:
  - HASL (Hot Air Solder Leveling) – Traditional, cost-effective.
  - ENIG (Electroless Nickel Immersion Gold) – Flat surface, good for fine-pitch components.
  - OSP (Organic Solderability Preservative) – Simple, but less durable.

8. Electrical Testing & Quality Control

- Automated Optical Inspection (AOI) checks for defects.
- Flying Probe Test or Bed-of-Nails Test verifies electrical connectivity.

9. Final Cutting & Packaging

- The PCB panel is routed into individual boards.
- Boards are inspected and shipped for PCB Assembly (PCBA).

♦ Types of PCB Fabrication:

Type	Description	Common Uses
Single-Layer PCB	Only one conductive layer.	Simple electronics (LEDs, calculators).
Double-Layer PCB	Copper on both sides.	Consumer electronics, power supplies.
Multi-Layer PCB (4+ layers)	Multiple conductive layers.	Smartphones, servers, medical devices.
Flexible PCB	Made of bendable materials (polyimide).	Wearables, aerospace, foldable devices.
Rigid-Flex PCB	Combines rigid and flexible sections.	Military, medical implants.
HDI PCB	High-density interconnects (microvias).	5G, IoT, compact electronics.

♦ Technical Parameters

Item	Specification
Laers	1~64
Board thickness	0.1mm-10.0mm
Material	FR-4,CEM-1/CEM-3,PI,High Tg,Rogers
Max panel size	32"×48"(800mm×1200mm)
Min hole size	0.075mm
Min line width	3mil(0.075mm)
Surface finish	OSP,HASL,Imm Gold/Nickel/Ag, Electric gold
Copper thickness	0.5-7.0OZ
Soldermask	Green/Yellow/Black/White/Red/Blue
Silkscreen	Red/Yellow/Black/White
Min PAD	5mil(0.13mm)
Inter package	Vacuum
Outer package	Carton
Outline tolerance	±0.75mm
Hole tolerance	PTH:±0.05 NPTH:±0.025
Certificate	UL,ISO 9001,ISO14001,IATF16949
Special request	Blind hole+Gold finger + BGA
Material Suppilers	Shengyi, KB, Nanya, ITEQ,etc.

Product Tags:

Fr4 pcb board fabrication

Charger pcb board fabrication

Fr4 pcb fabrication assembly