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MOQ : 1
Price : Send us Gerber file for free quotation
Payment Terms : T/T
Layer : 12 Layer
Material : Rogers RT5880
Thickness : 1.8 mm
Min. Line Width/Space : 0.1/0.1mm
Copper Thickness : 1OZ
Surface Finishing : ENIG
Color : Blue
Application : Communication System
Certificate : UL & IPC Standard & ISO
Service : One Stop Turnkey Service
Rogers RT5880 High Frequency PCB Satellite Communication System Application
♦ What's High-Frequency PCB?
High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.
♦ Features of High-Frequency PCB
Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).
Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.
Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.
♦ Difficulties in High-frequency PCB Manufacturing Process
Material processing is difficult: PTFE drilling is prone to burrs, and tungsten carbide drill bits + plasma cleaning are required.
High micropore precision: small holes are prone to offset, laser drilling + electroplating filling holes.
Difficult graphic transfer: small line width is prone to deviation, LDI lithography + fine etching.
Difficult inter-layer alignment: lamination is prone to misalignment, CCD alignment control offset ≤±50μm.
Difficult surface treatment: uneven coating affects performance, and the coating thickness is strictly controlled.
♦ Technical Parameters
| Item | Specification | 
| Laers | 1~32 | 
| Board thickness | 0.1mm-7.0mm | 
| Material | FR-4,CEM-1/CEM-3,PI,High Tg,Rogers | 
| Max panel size | 32"×48"(800mm×1200mm) | 
| Min hole size | 0.075mm | 
| Min line width | 3mil(0.075mm) | 
| Surface finish | OSP,HASL,Imm Gold/Nickel/Ag, Electric gold | 
| Copper thickness | 0.5-7.0OZ | 
| Soldermask | Green/Yellow/Black/White/Red/Blue | 
| Silkscreen | Red/Yellow/Black/White | 
| Min PAD | 5mil(0.13mm) | 
| Inter package | Vacuum | 
| Outer package | Carton | 
| Outline tolerance | ±0.75mm | 
| Hole tolerance | PTH:±0.05 NPTH:±0.025 | 
| Certificate | UL,ISO 9001,ISO14001,IATF16949 | 
| Special request | Blind hole+Gold finger + BGA | 
| Material Suppilers | Shengyi, KB, Nanya, ITEQ,etc. | 
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