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LED Aluminum Circuit Board LED Lights Lamp PCB Integrated Circuit Board

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LED Aluminum Circuit Board LED Lights Lamp PCB Integrated Circuit Board

MOQ : 1

Payment Terms : T/T

Delivery Time : 5-30 word days

Layer : 2 L

Material : Al

Board Thickness : 2.0mm

Surface Finish : OSP

Pin Space : 0.25mm

Application : Lights Lamp

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LED Aluminum Circuit Board LED Lights Lamp PCB Integrated Circuit Board


What is LED PCB Assembly?


LED PCB Assembly refers to the process of mounting, soldering and electrically connecting light-emitting-diode (LED) packages and their driver/control components onto a printed circuit board (PCB) that has been specially designed for high heat dissipation, so that the finished module can be powered and emit light immediately. Unlike conventional PCBA, LED PCB Assembly focuses on opto-thermal-electrical co-design:


  1. Substrate & thermal management
    • Aluminum-core (MCPCB), copper-core or ceramic substrates are used to conduct heat away from the LED junction.
    • Thick copper planes, thermal vias and TIMs lower the junction-to-ambient thermal resistance.
  2. Optical requirements
    • High-reflectivity white solder-mask (≥88 % reflectance) is applied to maximize light output.
    • Phosphor dispensing or color-bin matching is controlled to keep chromaticity and CRI within spec.
  3. Typical process flow
    Incoming inspection → solder-paste stencil printing (optimized for thermal pads) → high-speed pick-and-place (polarity check) → reflow soldering (peak 240-255 °C, nitrogen atmosphere) → AOI/AXI → selective wave (if THT parts) → optical & electrical test (luminous flux, color temp, junction temp) → burn-in → conformal coating (lens area masked) → final QC & pack.
  4. Key applications
    Street lighting, automotive lamps, flashlights, surgical lights, TV backlights, high-resolution LED displays—anywhere high brightness, long life and good heat control are required.


Technical Parameters


PCB Assembly Capability

Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L<2mm

Maximum

L≤800mm, W≤460mm

L > 1200mm, W>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

T>2mm



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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines


2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%


3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production




Product Tags:

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